BiSmart

A state-of-the-art solution that is reshaping the landscape of Blister Inspection Systems. Seamlessly integrating advanced AI and an intuitive auto-learning feature, BISmart empowers you to harness the true capabilities of artificial intelligence.

Powered by cutting-edge AI, Machine Learning, and Deep Learning technology, BISmart bids farewell to manual errors, welcoming a new era of heightened efficiency and accuracy in meeting the stringent requirements of your packaging line.

Features of BiSmart

• Auto learn by AI
• Oscilloscope-based breakdown identification
• 21 CFR part 11 compliant
• High-speed operation of up to 800 blisters per minute
• Singlehood with Top, Side, & bottom illumination
• LDAP connections for centralised login
• IoT-enabled self-diagnostics
• Auto setting of tolerances
• Integration ofthe  accept/reject verification sensor
• Inspection of White on White, Grey on Grey, and Double Layer Tablets as a standard feature

Benefits of BiSmart

• Matches the throughput of the blistering machine and Production Efficiency
• Adaptability and Reduced Setup Time with auto-teaching
• Proactive Maintenance and Minimized Downtime
• Consistency and Quality Assurance
• Proven track record of varied OEM Integration
• Enriched MIS – connecting to centralized servers – SCADA connectivity
• No loss of packing material due to auto-learn
• Resource Efficiency and Cost Savings with optimum use of packing material
• OS Agnostic
• Centralized Reports for multiple systems